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EDN: Chiplet innovation isn’t waiting for perfect standards
As monolithic SoCs reach their limits, chiplets offer a more scalable and cost-effective path forward. Despite incomplete standards, companies are moving ahead using modular design and flexible interconnects, with Arteris highlighting the role of NoC IP and automation in enabling
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EDN: Last-level cache has become a critical SoC design element
As AI-driven SoCs integrate increasingly heterogeneous compute engines, last-level cache (LLC) has become a critical architectural element for balancing performance, power, and determinism. Positioned between on-chip subsystems and external memory, LLC reduces latency and off-chip traffic but only when carefully
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SemiWiki: Securing RISC-V Third-Party IP: Enabling Comprehensive CWE-Based Assurance Across the Design Supply Chain
As RISC-V adoption grows across commercial and government programs, integrating third-party IP cores introduces supply chain security challenges that require structured, design-level assurance. This article highlights a scalable, CWE-based methodology demonstrated by Cycuity (an Arteris brand) with SiFive and BAE
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Semiconductor Engineering: AI Energy Gap and Chiplets: Why Data Movement Matters
At the panel discussion at Chiplet Summit 2026, where Arteris was among the experts, participants emphasized that efficient AI chiplets require more than fast physical links like UCIe—they demand smart, system-level architecture around data movement, coherency, and protocol choice. As
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Electronic Design: Bridging the Gap to Chiplet Interoperability
This article examines the gap between today’s tightly managed multi-die implementations and the long-term vision of true multi-vendor chiplet interoperability. It explains how companies are deploying homogeneous and heterogeneous architectures, why proprietary flows still limit plug-and-play integration, and how standards
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EE Times: The Data Dilemma: Cracking the Code of Data Movement for the Next Wave of Semiconductor Innovation
As semiconductor architectures scale toward chiplets, multi-die SoCs, and AI-driven workloads, data movement—not raw compute—has emerged as the primary limiter of performance, power, and scalability. The article argues that network-on-chip fabrics are becoming the true center of gravity in modern
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Semiconductor Engineering: Solving Real-World AI Bottlenecks
This article explains how modern AI SoCs are increasingly limited by data movement and memory latency rather than raw compute. It highlights the role of efficient interconnects and shared last-level caches in reducing latency, power consumption, and DRAM traffic, and
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EDN: AI workloads demand smarter SoC interconnect design
This EDN article explains how AI workloads are pushing traditional SoC interconnect design beyond practical limits, making intelligent automation essential. Physically aware NoC algorithms optimize topology, power, latency, and timing closure, enabling scalable AI SoCs from data centers to the
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2026 Predictions: System-Level Design, AI-Native Workflows, and the Rise of Multi-Die Compute Fabrics
Explore 2026 semiconductor predictions as AI accelerates system-level design, multi-die compute fabrics, chiplets, 2.5D/3D integration, and AI-native architecture workflows reshape how advanced systems are built and verified.
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Advancing Europe’s Automotive Chiplet Vision: Arteris Joins CHASSIS to Accelerate Software-Defined Mobility
Arteris joins CHASSIS, Europe’s open automotive chiplet initiative with advanced NoC and multi-die interconnect technology that accelerates software-defined mobility.
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