Resources

Explore case studies, datasheets, webinars, presentations, technical papers, and videos to learn more about Arteris products.

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Datasheet
Datasheet

Accelerate AI-Driven Silicon Innovation with Arteris Multi-Die Solution

The Arteris Multi-Die Solution delivers flexible design scalability for chiplet-based systems, optimal PPA, highest quality-of-results (QoR), functional safety and broad standards support to achieve the fastest time to silicon.

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Datasheet

Ncore Multi-Die Option Datasheet

  • Multi-die cache coherent option for Ncore up to 4 dies
  • Homogeneous and heterogeneous architectures
  • Fully-connected or mesh topologies
  • Pre-integrated with 3rd – party UCle 1.1 controller via AMBA CXS.B interface
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Datasheet

FlexNoC Reorder Buffer Option Datasheet

  • Unlock high-speed data flow with concurrent memory channel reads and optimized interleaving.
  • Achieve seamless responsiveness by managing out-of-order memory responses effortlessly.
  • Tailor buffer sizes and channel counts for both small and large-scale designs.
  • Handle intricate memory architectures with ease while preventing bottlenecks.
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Datasheet

CodaCache™ Last-Level Cache IP Datasheet

  • Standalone, highly configurable last level cache
  • Arm® AMBA® AXI compliant
  • Configurable way partitioning, sizing, & scratchpad configurations
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Datasheet

CSRCompiler™ Datasheet – The HW/SW Interface Foundation for Design Innovation

  • Production-proven method to describe the required behaviors and implementation details of the HSI
  • True cross-compiler with extensive validation of input formats, verifying semantic and syntactic correctness.
  • Extremely fast, generates in seconds superior quality synthesizable RTL, software headers, UVM RAL, Docx/HTML documentation
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Datasheet

FlexNoC 5 & FlexWay 5 Functional Safety (FuSa) Option

  • ISO 26262 ASIL D certifiable. Helps enable the highest level of functional safety.
  • Comprehensive safety features. ECC, packet consistency checkers, unit duplication, initiator timeout, FMEDA generation, and fault reporting logic BIST.
  • Error detection and correction. Ensure data integrity and system operation.
  • Fault detection and redundancy. Enhance system reliability and resilience.
  • Compliance with industry standards. Helps meet automotive and industrial safety requirements.
  • Peace of mind. Helps to ensure end-user and environmental safety.
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Datasheet

FlexNoC Reliability Option for Enterprise Applications

  • Enables robust reliability in enterprise SoC designs
  • Helps with seamless coordination of data and control signals in challenging environmental conditions
  • Enhanced data integrity while remaining customizable for specific enterprise applications
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Datasheet

FlexNoC Reliability Option for Industrial Applications

  • Enabling Long-term performance and reliability
  • Helps address the issues of wear, environmental threats, and stress on components
  • Immediate fault mitigation through robust error correction and data integrity
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Datasheet

FlexNoC XL Option Datasheet

  • Advanced mesh editor
  • Efficient multicast and broadcast
  • VC-Link™ virtual channels; Source synchronous communications
  • HBMx support e.g. HBM2/HBM2E/HBM3 (via a dedicated 3rd party memory controller and PHY)
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Datasheet

FlexWay® 5 Core Interconnect IP Datasheet

  • Entry-level Non-coherent network-on-chip (NoC) Interconnect IP
  • Particularly well suited to cost-efficient, low-power Internet-of-Things (IoT) edge devices
  • Protocol interoperability: AMBA 5, AXI, AHB, APB; OCP; PIF
  • Meets ISO 26262 ASIL D requirements.
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Datasheet

Magillem™ Connectivity Datasheet – Complete SoC Integration Solution

  • Single source of truth environment for SoC design that shortens and streamlines the IP integration process
  • Reliable scalability for large designs
  • Correct by construction designs for better quality with built-in checks
  • Improve design productivity with the automation of time-consuming tasks
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Datasheet

Magillem Registers Datasheet – A Fully Automatic System Memory Map Solution

  • Import and capture register descriptions from different formats into a single database
  • Reduce errors and misalignments thanks to a synchronized database and comprehensive consistency checks
  • Advanced parameterization, including configurable and conditional properties, custom-specific access types, and hierarchical properties
  • Flexible generator customization performed for reg bank, UVM RAL, and C headers in addition to a Docx/HTLM documentation generator
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Datasheet

Ncore® Cache Coherent Interconnect Datasheet

  • Cache coherent network-on-chip (NoC) interconnect IP
  • Arm® AMBA® CHI and ACE interoperability; CCIX protocol support for multi-chip systems
  • ISO 26262-compliant functional safety mechanisms
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Presentation
Presentation

Architecting the Future of Deep Learning Presentation

Learn about the history of artificial intelligence (AI), machine learning, (ML), and deep learning. Keynote presentation at the 2018 eSilicon “ASICs Unlock Deep Learning Innovation” seminar.
KEYWORDS: Artificial intelligence (AI); machine learning (ML); neural networks (NN); deep learning

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Presentation

Arm & Arteris AI and ISO 26262 Presentation

Arm & Arteris joint presentation from ICCAD China 2018 describes how new artificial (AI) and machine learning (ML) acceleration IP from Arm, like the Arm® NPU and Mali™ C71, can be implemented in ISO 26262-compliant automotive systems with the help of functional safety mechanisms in the Arteris FlexNoC and Ncore interconnects.
KEYWORDS: ISO 26262, functional safety, automotive, neural network

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Arm TechCon: Implementing ISO 26262 Compliant AI Systems-on-Chip with Arm and Arteris

Arm, Arteris, and Dream Chip Technologies joint presentation from Arm TechCon 2019 explains IP integration requirements for AI subsystems in ISO 26262-compliant chips. With an emphasis on techniques and safety mechanisms to enhance the diagnostic coverage of SoCs integrating an NPU and Safety Island. Topic areas include system design to comply with ISO 26262, system-level diagnostics, Network-on-Chip (NoC) safety mechanisms, subsystem isolation, and end-to-end error protection.
KEYWORDS: ISO 26262, functional safety, automotive, neural network

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Presentation

Automating the Generation of Scalable and Reusable FMEDA in Complex Systems-on-Chip (SoCs)

Presented at IQPC Application of ISO 26262 2022 Conference, describes an approach that uses a hierarchal and modular library of safety components to describe failure modes, safety mechanism diagnostic coverage, and other functional safety metrics at a level that scales with the size and complexity of an SoC and enables reuse for the creation of SoC platform derivative chips, which is common in our industry.
KEYWORDS: FMEDA, traceability, functional safety, ISO 26262

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Building Better IP with RTL Architect NoC IP Physical Exploration

Voted one of the “Top Ten Best Presentations” at SNUG Silicon Valley 2023, this presentation discusses the importance of NoCs and their impact on timing analysis and power consumption. It introduces a flow and methodology that utilizes RTL-based estimation of timing and power consumption using RTL Architect in conjunction with Arteris’ FlexNoC 5 and Ncore NoC development frameworks. FlexNoC 5 facilitates up to 5X faster physical convergence of the back-end physical design time and effort.

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Presentation

Challenges Adopting Fault Injection to Support Safety Analysis in Complex SoCs

Learn about fault simulator and EDA tools requirements; Using FMEA to create fault injection campaign; Guidelines/lesson learned for simulating different fault types; Analysis and documentation.
KEYWORDS: ISO 26262, SoCs, FMEA, fault, safety

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Presentation

FMEDA Automation for Scalability and Reuse in Complex Systems on Chips (SoCs)

Failure modes, effects, and diagnostic analysis (FMEDA) for sophisticated chips with hundreds of IP blocks are fraught with complexity and opportunities for systematic errors. This presentation will describe an approach that uses a hierarchal and modular library of safety components to describe failure modes, safety mechanism diagnostic coverage, and other functional safety metrics.
KEYWORDS: FMEDA, traceability, functional safety, ISO 26262

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Presentation

Fundamentals of ISO 26262 Part 11 for Semiconductors

Arm TechCon presentation that describes what is new in ISO 26262 2nd Edition Part 11, “Guidelines on application of ISO 26262 to semiconductors.”
KEYWORDS: ISO 26262; diagnostic coverage; FMEDA; and ASIL tailoring

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Presentation

Implementing Low-Power AI SoCs Using NoC Interconnect Technology

Presented at The Linley Spring Processor Conference 2020, describes lessons learned using network-on-chip (NoC) technology to implement AI processing SoCs that meet explosive bandwidth and tight latency requirements while meeting stringent power consumption needs.
KEYWORDS: AI/ML, neural network, low power

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Implementing Machine Learning & Neural Network Chip Architectures

Presentation describes types processing elements for neural net acceleration, current state-of-the-art AI SoC architectures, and influence of interconnect and memory architectures on AI data flow.
KEYWORDS: Artificial intelligence (AI); machine learning (ML); neural networks (NN); hardware acceleration

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Presentation

Is the Missing Safety Ingredient in Automotive AI Traceability?

Presented at The Linley Spring Processor Conference 2022, describes the importance of traceability as it applies to managing SoC requirements and customer deliverables whilst also shortening the path to functional safety certification including ISO 26262.
KEYWORDS: traceability, AI/ML, functional safety, ISO 26262, ADAS.

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Presentation

ISO 26262 System-on-Chip (SoC) Safety Analysis for ADAS and AV

Training materials for the 3-hour workshop at the Automotive IQ 8th Annual ISO 26262 for Conference in Dusseldorf, Germany. Explains how explains how SoC integrators validate FMEDA metrics using fault simulators and EDA simulations, and how system design teams can take advantage of these results to optimize the system-level safety concept.
KEYWORDS: ISO 26262; FMEDA; fault injection

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Presentation

ISO 26262: FMEA before FMEDA

This Automotive IQ “Guidance of ISO 26262 to Semiconductors” presentation includes, develop, plan analyze, merge, and validate failure mode effects (FMEA) creation flow. IP architecture and best practices, examples of element decomposition, and merging element analysis and much more.
KEYWORDS: ISO 26262, FMEA, FMEDA, safety mechanisms, fault injection

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Presentation

ISO 26262: What to Expect From Your Chip or IP Provider

This Automotive IQ “Guidance of ISO 26262 to Semiconductors” presentation provides “lessons learned” regarding ISO 26262 deliverables that Tier-1s and semiconductor vendors should expect from their suppliers along with practical advice given regarding the DIA and Safety Manual contents as well as FMEDA expectations for configurable IP.
KEYWORDS: ISO 26262, FMEDA, FMEA

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Lessons Learned Integrating AI/ML Accelerators into Complex ISO 26262 Compliant Systems-on-Chip

Presented at the ISO 26262 for Semiconductors (Munich) Conference, this presentation describes the differences between “regular” and AI-enabled automotive chips in the following dimensions: PPA, Safety and Schedule.
KEYWORDS: ISO 26262, AI/ML, functional safety, fault injection, neural network

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Presentation

Routing Congestion: The Growing Cost of Wires

Arm TechCon presentation that describes the benefits of benefits of packet-based on-chip interconnect networks.
KEYWORDS: network-on-chip (NoC); routing congestion

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Presentation

Safety Considerations for Network-on-Chip (NoC) Development

This presentation illustrates functional safety challenges in system design and adherence to the ISO 26262 standard for automotive electronics. It highlights Network-on-Chip (NoC) safety mechanisms, including timeouts, IP Block isolation, and end-to-end interface protection.

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Presentation

The Role of Networks-on-Chips Enabling AI/ML Silicon and Systems

Discover how networks-on-chips (NoCs) are revolutionizing AI/ML across sensors, edge devices, and data centers. This video presentation explores how NoCs enable rapid data movement, seamless component integration, and efficient chip-to-chip communication, paving the way for a new era of AI-powered devices.

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Presentation

Using Synopsys Z01X to Accelerate the Fault Injection Campaign of a Fully Configurable IP

Principles and real-world practices of ISO 26262 for semiconductor design teams. Explains how configuration in IP design can be used as an advantage to automatically drive fault injection using Synopsys Z01X tools. We will demonstrate using a real case study of diagnostic coverage, FMEDA creation and ASIL determination for a fully configurable IP.
KEYWORDS: Synopsys Z01X; fault injection; FMEDA; ASIL

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Technical Paper
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Technical Paper

Accelerate and Derisk RISC-V-based SoC Designs with Arteris Solution Brief

Connect RISC-V computing and accelerate subsystems with silicon-proven interconnect IP. Unify protocols such as AMBA across 100’s of re-used IP blocks cutting complexity and maximizing resource efficiency. Derisk project schedules with leading system IP and expert support.
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Technical Paper

A Configurable Test Infrastructure using a Mixed-Language and Mixed-Level IP Integration IP-XACT Flow

This paper written with NXP describes an efficient integration flow for mixed-language and mixed-abstraction level IPs through IP-XACT flow automation.
KEYWORDS: Network-on-Chip (NoC); Routing congestion; physical design
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Technical Paper

A Design Flow for Critical Embedded Systems

In this paper by Airbus, Thales, STMicroelectronics, Arteris and other, learn how IP encapsulation/packaging and interoperability using IP-XACT enabled automation in a complex verification & validation flow for aeronautical systems.
KEYWORDS: DO-178C, DO-254, ARP4754, ECSS Q60-02, Q80, E40, High-Level Synthesis, SystemC/TLM, IP-XACT, Assertion-Based Verification (ABV), Property Specification Language (PSL)
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Technical Paper

A Power Consumption Estimation Approach for Embedded Software Design using Trace Analysis

This paper presents a lightweight and cost-effective approach to power estimation suitable for software developers. It relies on trace analysis and high-level modeling of architectures to perform quick and efficient power consumption estimations without losing accuracy.
KEYWORDS: power consumption; embedded software design; power management; trace analysis
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Technical Paper

A SystemC Extension for Enabling Tighter Integration of IP-XACT Platforms with Virtual Prototypes

This paper describes a configurable SystemC extension that simplifies the syntax for expressing register and bit field accesses and enables automation of virtual platform and hardware-software interface (HSI) development.
KEYWORDS: SystemC, Virtual Hardware Prototyping, IP-XACT, code generation
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Technical Paper

AMS System-Level Verification and Validation using UVM in SystemC and SystemC-AMS: Automotive Use Cases

This 12-page paper published in the peer-reviewed IEEE Design & Test journal explains how Universal Verification Methodology (UVM), initially developed for digital systems, can be extended to analog and mixed signal systems with the help if IP-XACT-based IP packaging and design flow automation.
KEYWORDS: Coverage Driven Verification (CDV), Design Under Test (DUT), Electronic Control Unit (ECU), Electronic System Level (ESL), functional verification, Hardware In the Loop (HIL), system simulation, SystemC, SystemC-AMS, Timed Data Flow (TDF), Transaction Level Modeling (TLM), Universal Verification Methodology (UVM), system verification, Virtual Prototyping (VP)
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Technical Paper

Application Driven Network-on Chip Architecture Exploration & Refinement for a Complex SoC

Peer-reviewed technical journal article from Springer’s “Design Automation for Embedded Systems Journal.” Summarizes the various features a NoC is required to implement to be integrated in modern SoCs. Describes a top-down approach, based on the progressive refinement of the NoC description from its functional specification (Sect. 4) to its verification (Sect. 8).
KEYWORDS: Network-on-Chip (NoC); Quality-of-Service (QoS); Routing
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Technical Paper

Building a Portable Stimulus Flow Based on Magillem IP-XACT Packaging

This paper written by Nokia and Mentor Siemens describes an efficient integration flow using Portable Stimulus and IP-XACT flow automation.
KEYWORDS: IP-XACT, portable stimulus, verification intent, design under test (DUT)
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Technical Paper

CodaCache: Helping to Break the Memory Wall

This paper describes a novel configurable last level cache IP, CodaCache, that provides an easy-to-integrate solution giving system architects the capability to configure and adapt to their specific needs. Key technologies implemented in this IP are per-master way partitioning, scratchpad RAM allocation, AXI interfaces and functional safety mechanisms.
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Technical Paper

Fundamentals of Semiconductor ISO 26262 Certification: People, Process and Product

Written by an ISO 26262 working group member who contributed to the new ISO 26262:2018 Part 11, this paper dispels myths about ISO 26262 certification and seeks to enhance the reader’s knowledge regarding all aspects of the ISO 26262 standard. This paper also discusses the standard’s applicability not only to electronic products, but also to the people and processes employed to create them.
KEYWORDS: ISO 26262 certification; ASIL; FMEDA
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Technical Paper

Generation of UVM Compliant Test Benches for Automotive Systems using IP-XACT with UVM-SystemC and SystemC AMS

This paper presents a methodology and flow to automate the test bench creation for automotive heterogeneous HW/SW systems, using SystemC, SystemC-AMS and IP-XACT.
KEYWORDS: Simulation; Verification; EDA Automation; SystemC; SystemC-AMS; IP-XACT; UVM
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Technical Paper

How to Efficiently Achieve ASIL-D Compliance Using NoC Technology

A closer look at ASIL-D compliance options for on-chip interconnects and NoCs, including redundancy, path diversity and error correction codes (ECC) is required to fully optimize an on-chip network to meet rapidly evolving technology and customer demands.
KEYWORDS: Network-on-chip (NoC); ISO 26262; functional safety; redundancy; ECC
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Technical Paper

HW / SW Interface Generation Flow Based on Abstract Models of System Applications and Hardware Architectures

This paper presents a code generation flow to deploy system applications over hardware architectures based on abstract descriptions.
KEYWORDS: HW/SW Interface, IP-XACT, hardware abstraction layer (HAL)
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Technical Paper

Making Cache Coherent SoC Design Easier with Ncore

As the number and variety of computing elements in SoCs grow, specific application areas require the tight connection of key processing elements through coherency. Ncore Interconnect IP from Arteris makes cache coherent SoC designs easier, saving 100’s of person-years effort per project vs DIY solutions.
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Technical Paper

Making Soc Integration Simple – Achieve Higher Productivity And Quality

This paper explores engineers’ challenges, how Arteris can help, and why such solutions will not only benefit design teams in the short run by boosting their productivity and achieving successful tape-outs but will also result in long-term savings as the teams are free to focus on the core business and leverage their technical expertise where it matters most.
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Technical Paper

Mobileye Case Study: Using Arteris for ADAS

In this 4-page paper, created with the participation of Mobileye, you will learn how the world’s #1 vision-based automotive ADAS company uses Arteris FlexNoC interconnect IP to address demanding high bandwidth and low-latency requirements.
KEYWORDS: Network-on-Chip (NoC); end-to-end QoS; timing closure
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Technical Paper

Optimizing Enterprise-Class SSD Host Controller Design with Arteris FlexNoC Network-On-Chip Interconnect IP

Enterprise SSD Endurance & Data Protection technical paper that explains how the leading enterprise SSD controller design teams are using network-on-chip (NoC) interconnect technology to optimize their designs for power consumption and performance while increasing reliability and availability.
KEYWORDS: Network-on-chip (NoC); routing congestion; SSD
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Technical Paper

Power Dissipation of the Network-on-Chip in a System-on-Chip for MPEG-4 Video Encoding

An oldie but a goodie: Explains power benefits of NoC technology by characterizing a multi-processor system-on-chip (MPSoC) for MPEG4, AVC/H.264 encoding. Explains NoC power model used to analyze power consumption and dissipation.
KEYWORDS: Network-on-chip (NoC); power consumption
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Technical Paper

Re-Architecting SoCs for the AI Era

This paper defines AI, describe its applications, the problems it presents, and how chip designers can address those problems through new and holistic approaches to SoC and network on chip (NoC) design.It also describes challenges implementing AI functionality in automotive SoCs with ISO 26262 functional safety requirements.
KEYWORDS: Artificial Intelligence (AI), Machine Learning (ML), Dataflow, ISO 26262, Functional Safety, Semiconductor
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Technical Paper

Reinventing Traceability: Adding Domain Intelligence with Arteris Harmony Trace™

This paper proposes and explains the Arteris Harmony Trace solution which Increases system quality and functional safety assessments by identifying and fixing the traceability gaps between disparate systems.
KEYWORDS: Traceability; IP-XACT; Requirements; EDA Automation; Functional Safety; Quality; ISO 26262; IEC 61508; ISO 9001; IATF 16949
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Technical Paper

Routing Congestion: The Growing Cost of Wires

The congestion of wires in the place and route (P&R) stage of chip design poses an increasingly significant challenge to creating low cost, high performance chip designs. This paper introduces packet based network-on-chip as a means of enabling configuration link widths, shows experimental results, and describes other benefits of packet-based interconnect networks.
KEYWORDS: Network-on-Chip (NoC); Routing congestion; physical design
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Technical Paper

Scalability – A Looming Problem in Safety Analysis

Misbehavior in the electronics can lead to accidents, even fatalities. This paper describes how ISO 26262 standard and in particular the Failure Modes, Effects and Diagnostic Analysis (FMEDA) can be leveraged to address this real concern.
KEYWORDS: FMEDA; ISO 26262; Traceability; IEEE P2851
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Technical Paper

Security in Artificial Intelligence

Unlock insights into AI security challenges & protection strategies. Dive deep into the dual role of AI in cybersecurity.
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Technical Paper

Using Machine Learning for Characterizations of NoC Components

This Award Winning Paper was presented at Synopsys SNUG Silicon Valley 2019. You will learn about modern NoC (Network-on-Chip) is built of complex functional blocks, such as packet switches and protocol converters. PPA (performance/power/area) estimates for these components are highly desirable during early design phases – long before NoC gate level netlist is synthesized.
KEYWORDS: ML, PPA,
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Technical Paper

Using Synopsys Z01X to Accelerate the Fault Injection Campaign of a Fully Configurable IP

In this 4-page paper, created with the participation of Mobileye, you will learn how the world’s #1 vision-based automotive ADAS company uses Arteris FlexNoC interconnect IP to address demanding high bandwidth and low-latency requirements.
KEYWORDS: Network-on-Chip (NoC); end-to-end QoS; timing closure
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Technical Paper

Using Virtual Prototypes to Improve the Traceability of Critical Embedded Systems Flow

This paper written with Imperas explains how the combination of innovative traceability techniques with an advanced virtual prototyping execution environment helps to detect and locate critical embedded system bugs situated at the frontier of hardware and software.
KEYWORDS: Embedded System; Traceability; Requirement; Specification; Design; Documentation; Virtual Prototype; Software; Hardware; SystemC; IP-XACT