Semiconductor Engineering: New Architectural Issues Facing Auto Ecosystem
, 2020年03月05日
New Architectural Issues Facing Auto Ecosystem
March 5th, 2020 – By Ann Steffora Mutschler
Semiconductor vendors are trying to do more system-level work, while EDA companies are starting to integrate some of their tools and IP, so they all work together, Shuler said. “For the Tier 1s this means, just like the hyperscalar companies like the Googles, the Facebooks, the Amazons, and the Microsofts, they are now designing their own chips. That means they’re competing below and they’re competing above. ‘Mr. OEM, we can take care of all of this for you. You just make the plastics. You don’t need to know how all this stuff works.’ And the OEMs are now saying, ‘Hey, wait a minute, this is our brand, this is our car. We need to start hiring chip people too.’ Everybody is, within the car itself, clashing from a business and technical standpoint,” Shuler said.
There are other potential conflicts and challenges to go along with this, such as what to do when data comes into a car, where and how that data should be processed, and who ultimately owns the data.
“Think about how much data your cell phone creates, as well as all of the security breaches that have happened,” said Arteris IP’s Shuler. “The car has a whole bunch of information just like that cell phone, and there’s a fight over who owns that info.
To learn more, please download this Technical Paper on “Re-Architecting SoCs for the AI Era”, please go here; http://47.121.186.162:7777/download-re-architecting-socs-for-the-ai-era
To read the entire article on the SemiEngineering page, please click here: https://semiengineering.com/new-architectural-issues-facing-auto-ecosystem/